MCM-11939：Active Second Source Wafer Fab Foundry Corbeil & Melexis Probing Site Corbeil [MLX90372]
■Type of change
●Move all or parts of production to a different wafer fab site.
●Move of all or part of electrical wafer test and/or final test to a different test site.
■Description of change
●Old：Current released Wafer Fab Location: X-fab Kuching (Sarawak / Malaysia)
●New：Current released Wafer Fab Location: X-fab Kuching (Sarawak / Malaysia)+ X-fab Corbeil (France / Europe)
●Old：Electrical wafer test location: currently released locations
●New：Electrical wafer test location: currently released locations+ Melexis Corbeil (France / Europe)
■Marking of parts / traceability of change
●Lots produced at X-fab Corbeil will have a different lot ID-number. The first letter of the lot ID will start with "F". Traceability ensured by lot number and datecode through the Melexis ERP system.
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MLX90372 、 MLX90372GGO-ACE-300-RE 、 MLX90372GDC-ACE-300-RE 、 MLX90372GVS-ACE-308-RE |
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PCN/EOL |
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Please see the document for details |
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DMPS4 GR MCM;TSSOP16 GR |
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English Chinese Chinese and English Japanese |
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21-Mar-2022 |
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MCM-11939 |
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5.3 MB |
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