PCN MCM-21328: Active Second Source Wafer Fab Foundry Dresden & Probing Site Melexis Corbeil [MLX90363]
■Description of change
▲ Change #1
●Old：Wafer Fab Location: Current released WaferFab Location: XFAB Kuching [MALAYSIA]
●New：Wafer Fab Location: Current released Wafer Fab Location: XFAB Kuching [MALAYSIA] + XFAB Dresden [GERMANY]
▲ Change #2
●Old：Electical Wafer test location: Current released location: Melexis Ieper [BELGIUM] + Melexis Kucing [MALAYSIA]
●New：Electrical Wafer test location: Current released location: Melexis Ieper [BELGIUM] + Melexis Kucing [MALAYSIA] + Melexis Corbeil [FRANCE]
■Reason / motivation for change
●As a responsible and future oriented player, Melexis is protecting its customers. This includes to secure the supply chain against environmental and/or material based events (contingency plan).
●The increase in business leads to wafer demand beyond XFAB Kuching [MALAYSIA] and beyond Melexis Ieper [BELGIUM] & Melexis Kuching [MALAYSIA] probing capabilities.
■Marking of parts / traceability of change
●Lots produced at XFAB DRESDEN will have a different lot ID-number. Currently the first letter of the lot ID will start with "D".
●Traceability ensured by lot number and datecode through the Melexis ERP system.
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MLX90363 、 MLX90363KDC-ABB-000-RE 、 MLX90363KGO-ABB-000-RE 、 MLX90363LDC-ABB-000-RE 、 MLX90363LGO-ABB-000-RE |
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PCN/EOL |
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Please see the document for details |
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SOIC8 GR;TSSOP16 GR |
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English Chinese Chinese and English Japanese |
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28-Jan-2025 |
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MCM-21328 |
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5.7 MB |
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Jan-2026 |
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Add Second Source Wafer Fab Foundry |
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