CPZ28X Zener diode wafer process Product / Process Change Notice(PCN #243)
2022-12-22
■Devices affected:
●Zener diode wafer process CPZ28X: wafers, bare die in chip form, and packaged devices.
■Extent of change:
●The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and CPZ59X wafer processes, as indicated below and in figures 1-3. Additionally, the wafer diameter is changing from 5” to 6”, and the metallization is also being enhanced.
■Reason for change:
●Replacement wafer processes provide improved and consistent yield, as well as an enhanced metallization.
■Effect of change:
●This change does not affect the fit, form, or function of any device. The new wafer processes meet all electrical specifications of the individual devices listed on the following page.
■Earliest effective date of change:
●December 8, 2022
■Sample availability:
●Please contact your salesperson or manufacturer’s representative for samples.
●Zener diode wafer process CPZ28X: wafers, bare die in chip form, and packaged devices.
■Extent of change:
●The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and CPZ59X wafer processes, as indicated below and in figures 1-3. Additionally, the wafer diameter is changing from 5” to 6”, and the metallization is also being enhanced.
■Reason for change:
●Replacement wafer processes provide improved and consistent yield, as well as an enhanced metallization.
■Effect of change:
●This change does not affect the fit, form, or function of any device. The new wafer processes meet all electrical specifications of the individual devices listed on the following page.
■Earliest effective date of change:
●December 8, 2022
■Sample availability:
●Please contact your salesperson or manufacturer’s representative for samples.
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