CPZ28X Zener diode wafer process Product / Process Change Notice(PCN #243)
2022-12-14
■Devices affected:
●Zener diode wafer process CPZ28X: wafers, bare die in chip form, and packaged devices.
■Extent of change:
●The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and CPZ59X wafer processes, as indicated below and in figures 1-3. Additionally, the wafer diameter is changing from 5” to 6”, and the metallization is also being enhanced.
■Reason for change:
●Replacement wafer processes provide improved and consistent yield, as well as an enhanced metallization.
■Effect of change:
●This change does not affect the fit, form, or function of any device. The new wafer processes meet all electrical specifications of the individual devices listed on the following page. This change re
■Earliest effective date of change:
●December 8, 2022
■Sample availability:
●Please contact your salesperson or manufacturer’s representative for samples.
●Zener diode wafer process CPZ28X: wafers, bare die in chip form, and packaged devices.
■Extent of change:
●The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and CPZ59X wafer processes, as indicated below and in figures 1-3. Additionally, the wafer diameter is changing from 5” to 6”, and the metallization is also being enhanced.
■Reason for change:
●Replacement wafer processes provide improved and consistent yield, as well as an enhanced metallization.
■Effect of change:
●This change does not affect the fit, form, or function of any device. The new wafer processes meet all electrical specifications of the individual devices listed on the following page. This change re
■Earliest effective date of change:
●December 8, 2022
■Sample availability:
●Please contact your salesperson or manufacturer’s representative for samples.
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