ARINC 600 Enclosures
● Carlisle Interconnect Technologies’ (CarlisleIT) ARINC 600 Enclosures are designed and fabricated in our state-of-the-art manufacturing facility using top quality aircraft-grade materials to meet or exceed ARINC 600 specifications, as well as all civil and military aircraft application criteria. Our unique designs stand up to the most rigorous environmental hazards for in-flight and on-the-ground operations. Each enclosure is fully warrantied, ensuring that your avionics systems equipment will not only fit securely, but operate safely. Off-the-shelf designs or custom solutions are available. An optional plenum chamber and fan are also available to provide a positive pressure air cooling system.
■ FEATURES
● Durable, rugged construction
● Light-weight aluminum alloy
● 24-hour AOG support
● Clear chem film per MIL-DTL-5541, Type II, Class 3
● Materials meet flammability, optical smoke density, and toxic gas generation requirements
● RoHS-compliant in standard configurations
● Modular design with standard #6 screws (metric sizes available)
● Structural analysis
● Shock & vibration testing
● Crash safety testing
● Finite element analysis
● Flammability testing
● Environmental testing
● Air flow & cooling analysis and testing
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2020/6/9 |
|
|
|
|
|
SS-10008-052720 |
|
|
1.3 MB |
- +1 Like
- Add to Favorites
Recommend
- Cost-effective Test Cable Assemblies Designed for a Broad Range of Test and Interconnect Applications
- Keysight Technologies Acquires SCALABLE Network Technologies
- Smiths Interconnect NXS Series, New Ultra-High Density, Space Qualified Interconnect
- Smiths Interconnect Launches Blind Mate Active Optical Interconnect Compatible with VITA and SOSA Standards
- Smiths Interconnect’s cPCI launched on NASA Mars Perseverance Rover – Interconnect Product of the Year
- Keysight Technologies, Jiyun Technologies Collaborate to Deliver a Tailored, Compact Battery Test System
- Smiths Interconnect’s Solutions Help the Optical Interconnect Design Challenges in Space
- Accelerating Connectivity: Exploring High-Speed Data Connectors with Smiths Interconnect
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
