COMe-bSL6 USER GUIDE
●Kontron's Computer-on-Module COMe-bSL6 is a COM Express® Basic Type 6 pinout based on the Intel® 6th Generation Core ™ / Xeon® E3 v5 family processors, known as Skylake-H in this user guide. The COMe-bSL6 supports additional communication interfaces via a separate Chipset (CM236/QM170 PCH). Due to Intel' s 14nm technology, the Skylake–H offers increased efficiency and performance with TDP as low as 25 W, and no more than 45W. The Skylake- H features either Intel® Iris™ Pro Graphics or Intel ® HD Graphics.
■Features
●Intel® 6th Generation Core series, Xeon® E3 v5 family with CM236/QM170 PCH
●2 x DDR4-2133 SO-DIMM, up to 2x 16 GByte (non-ECC/ECC)
●High-speed connectivity includes 8x PCIe x1, 1x PEG x16, 1x 1 GbE
●Support for the Industrial temperature environment
■Benefits
●COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.
●The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s packaging.
●A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility differentiates products at various price and performance points and provides a built-in upgrade path when designing future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
●A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
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COMe-bSL6 、 38030-0000-20-4 、 38030-0000-28-4 、 38030-0000-28-8 、 38030-0000-20-7 、 38030-0000-28-7 、 38030-0000-19-5 、 36030-0000-27-5 、 38030-0000-19-3 、 38030-0000-27-3 、 38030-0000-16-2 、 38030-0000-24-2 、 38031-0000-16-2 、 38031-0000-24-2 、 38031-0000-19-3 、 38031-0000-27-3 、 38031-0000-20-4 、 38031-0000-28-4 、 38031-0000-28-8 、 COMe-bSL6 E3-1505L CM236 、 COMe-bSL6 E3-1505M CM236 、 COMe-bSL6 E3-1515M CM236 、 COMe-bSL6 i7-6822EQ QM170 、 COMe-bSL6 i7-6820EQ QM170 、 COMe-bSL6 i5-6442EQ QM170 、 COMe-bSL6 i5-6440EQ QM170 、 COMe-bSL6 i3-6102E CM236 、 COMe-bSL6 i3-6100E CM236 、 COMe-bSL6 G3902E CM236 、 COMe-bSL6 G3900E CM236 、 COMe-bSL6R E2S G3902E CM236 、 COMe-bSL6R E2S G3900E CM236 、 COMe-bSL6R E2S i3-6102E CM236 、 COMe-bSL6R E2S i3-6100E CM236 、 COMe-bSL6R E2S E3-1505L CM236 、 COMe-bSL6R E2S E3-1505M CM236 、 COMe-bSL6R E2S E3-1515M CM236 |
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018-Apr-24 |
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Rev. 1.4 |
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1060-7484 |
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2.1 MB |
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