Computer-on-Module COMe-bSL6 USER GUIDE
2022-01-17
●Introduction
■Product Description
◆Kontron's Computer-on-Module COMe-bSL6 is a COM Express® Basic Type 6 pinout based on the Intel® 6th Generation Core ™ / Xeon® E3 v5 family processors, known as Skylake-H in this user guide. The COMe-bSL6 supports additional communication interfaces via a separate Chipset (CM236/QM170 PCH). Due to Intel’s 14nm technology, the Skylake–H offers increased efficiency and performance with TDP as low as 25 W, and no more than 45W. The Skylake- H features either Intel® Iris™ Pro Graphics or Intel ® HD Graphics.
◆Basic COMe-bSL6 features are:
▲Intel® 6th Generation Core series, Xeon® E3 v5 family with CM236/QM170 PCH
▲2 x DDR4-2133 SO-DIMM, up to 2x 16 GByte (non-ECC/ECC)
▲High-speed connectivity includes 8x PCIe x1, 1xPEG x16, 1x 1 GbE
▲Support for the Industrial temperature environment
■Product Description
◆Kontron's Computer-on-Module COMe-bSL6 is a COM Express® Basic Type 6 pinout based on the Intel® 6th Generation Core ™ / Xeon® E3 v5 family processors, known as Skylake-H in this user guide. The COMe-bSL6 supports additional communication interfaces via a separate Chipset (CM236/QM170 PCH). Due to Intel’s 14nm technology, the Skylake–H offers increased efficiency and performance with TDP as low as 25 W, and no more than 45W. The Skylake- H features either Intel® Iris™ Pro Graphics or Intel ® HD Graphics.
◆Basic COMe-bSL6 features are:
▲Intel® 6th Generation Core series, Xeon® E3 v5 family with CM236/QM170 PCH
▲2 x DDR4-2133 SO-DIMM, up to 2x 16 GByte (non-ECC/ECC)
▲High-speed connectivity includes 8x PCIe x1, 1xPEG x16, 1x 1 GbE
▲Support for the Industrial temperature environment
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