Encapsulation Materials for FOWLP/PLP
2022-09-19
●Available in forms of granule, liquid, and sheet, according to the required encapsulation thickness and size, enabling compression molding and lamination molding. Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.
●MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot. Provide a better solution based on high loading technology of fine filler and resin design technology.
●Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity
●Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch) ,Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
●Enhances process reliability by warpage control and high adhesion (Low warpage of ultrathin module is achieved).Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio.Large encapsulation area.
●Achieving high mountability and high heat dissipation (Package warpage control).Suitable for large packages with heat spreaders exposed (T/C resistance improvement due to stress reduction).Compatible with nickel plating (Achieved high adhesion)
●Achieving the necessary mount reliability for automotive quality by industry's highest heat resistance and low CTE. "Corner reinforce type" also be available. Compliant with RoHS.
●Cures at low temperatures and can be applied for mount-reinforcement of precision parts that need to be protected from higt temperatures. Improves the mounting reliability of automotive parts, for which high bonding strength is required.
●Protection of “brain” of mobile terminal from drop impact.Underfill/Sidefill reinforcement material when BGA/CSP is mounted.
●Corresponding to the diverse applications such as adhesion, filling sealing, dam formation.Rapid curing at low temperatures and excellent adhesion.(Epoxy resin).Designed for curing with low-energy irradiation including LED-based UV light sources.(UV curing resin)
●MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot. Provide a better solution based on high loading technology of fine filler and resin design technology.
●Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity
●Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch) ,Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
●Enhances process reliability by warpage control and high adhesion (Low warpage of ultrathin module is achieved).Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio.Large encapsulation area.
●Achieving high mountability and high heat dissipation (Package warpage control).Suitable for large packages with heat spreaders exposed (T/C resistance improvement due to stress reduction).Compatible with nickel plating (Achieved high adhesion)
●Achieving the necessary mount reliability for automotive quality by industry's highest heat resistance and low CTE. "Corner reinforce type" also be available. Compliant with RoHS.
●Cures at low temperatures and can be applied for mount-reinforcement of precision parts that need to be protected from higt temperatures. Improves the mounting reliability of automotive parts, for which high bonding strength is required.
●Protection of “brain” of mobile terminal from drop impact.Underfill/Sidefill reinforcement material when BGA/CSP is mounted.
●Corresponding to the diverse applications such as adhesion, filling sealing, dam formation.Rapid curing at low temperatures and excellent adhesion.(Epoxy resin).Designed for curing with low-energy irradiation including LED-based UV light sources.(UV curing resin)
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