AN-B-066 DA1469x Application Hardware Design Guidelines
■This document provides the minimal reference schematic, circuit explanation, and design guidelines for Bluetooth® Low Energy applications based on the SoC of DA1469x family.
●Introduction
■The DA1469x is a family of multi-core wireless microcontrollers combining the newest Arm®Cortex®-M33 application processor with floating point unit, advanced power management functionality, a cryptographic security engine, analog and digital peripherals, a dedicated sensor node controller and a software configurable protocol engine (based on the Arm®Cortex®-M0+ processor) accompanied by a radio compliant to the Bluetooth®Low Energy 5.1 standard.
■The application processor executes code from the embedded memory (RAM) or an external QSPI Flash via a 16 kB 4-way associative cache controller, which is capable of on-the-fly decrypting without extra wait states.Sensor node controller allows sensor node operations and data acquisition without CPU intervention.
■Bluetooth®Low Energy connectivity is achieved by a new software-configurable Bluetooth®Low Energy protocol engine (MAC) with an ultra-low-power radio transceiver which is capable of +6 dBm output power,-97dBm sensitivity, offering a total link budget of 103dB.
■An advanced power management unit provides the capability to run from primary and secondary batteries and to supply external devices through the integrated SIMO DCDC and integrated LDOs. The JEITA-compliant charger allows rechargeable batteries to be charged over USB.
■The differentiation between the members of the DA1469x product family is presented inTable 1.
■The DA14693, the automotive qualified SoC, is treated in a dedicated application note.
|
DA1469x 、 DA1469x family 、 DA14691 、 DA14695 、 DA14697 、 DA14699 |
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
21-Jan-2022 |
|
|
Revision 1.7 |
|
|
AN-B-066 |
|
|
5.9 MB |
- +1 Like
- Add to Favorites
Recommend
- Renesas Launches World’s Most Highly Integrated Advanced Bluetooth Low Energy SoC DA1470x Family
- Renesas DSP Solution on Renesas Lab on the Cloud, Input Analog Signals Directly From A Signal Generator To The Rx231 Microcontroller Evaluation Board
- Renesas‘ Semiconductor Manufacturing Factory (Naka Factory) Fire: Production Capacity Has Recovered to 88%
- Renesas Announces 10 New Winning Combinations Integrating Celeno and Renesas Products
- Renesas ＆ Altran to Deploy First Social Distancing Wristwatch Using Ultra-Wideband Chipset with Low Rate Pulse
- Renesas and FAW Establish Joint Laboratory to Accelerate Development of Next-Generation Smart Vehicles
- Renesas Semiconductor Manufacturing Factory (Naka Factory)‘ Production Level Has Returned to 100%
- Renesas and Sequans Expand Their 5G Collaboration including Broadband IoT Module for 5G NR FR1/FR2
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
