LOCTITE ECCOBOND FP4451 damming material Technical Data Sheet

PublishTime：2022-08-10

●LOCTITE ECCOBOND FP4451 Provides the following product characteristics:
■Technology: Epoxy
■Appearance: Black
■Product Benefits
▲High purity
▲Minimal slumping
▲Green product
■Filler Weight, %: 72
■Cure: Heat cure
■Application: Encapsulant-dam
■Operating Temperature: -65 to 150℃
■Typical Package Application: BGA and IC memory cards
■Flammability Rating: UL 94 HB@25 mm thicknes
■LOCTITE ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type.

Brand of Product：	Henkel
Part#：	LOCTITE ECCOBOND FP4451 More Part#
Product Category：	damming material More
Application：	[ Encapsulant-dam ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	September 2016
Version Number：
Data Encoding：
Data Size：	65 KB

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