Tpli 200 Series Thermal Gap Filler
●Tpli™ 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad.
●Tpli 200’s exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material.
●Tpli 200 absorbs shock and relieves stresses,thus minimizing potential damage to components. Tpli 200 is electrically insulating,stable from -45°C to 200°C, and meets UL 94 HB rating.
■FEATURES AND BENEFITS
●Soft and compliant
●High Thermal performance
●Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
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Tpli 200 Series 、 Tpli™ 200 、 Tpli 200 、 Tpli 2xx 、 Tpli 240 、 Tpli 280 、 Tpli 220FG 、 Tpli 260 |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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06-29-22 |
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DS 06-29-22 |
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271 KB |
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