BERGQUIST HI FLOW THF 1000F-AC Known as BERGQUIST HI-FLOW 225F-AC Technical Data Sheet
● Thermal impedance: 0.10ºC-in²/W @ 25 psi
● Can be manually or automatically applied to the surfaces of room temperature heat sinks
● Foil reinforced, adhesive-coated
● Soft, thermally conductive 55°C phase change compound
■BERGQUIST HI FLOW THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink.
■BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.
■Above the 55 °C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.
■The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Bergquist Product Management for applications that are less than 0.07'' square.
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[ Computer and peripherals ][ Power conversion ][ High performance computer processors ][ Power semiconductors ][ Power modules ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2020 |
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62 KB |
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