BERGQUIST HI FLOW THF 500 Known as BERGQUIST HI-FLOW 625 Technical Data Sheet
● Thermal impedance: 0.71ºC-in²/W @ 25 psi
● Electrically isolating
● 65°C phase change compound coated on PEN film
● Tack-free and scratch-resistant
■BERGQUIST HI FLOW THF 500 is a film-reinforced phase change material. The product consists of a thermally conductive 65°C phase change compound coated on PEN film. BERGQUIST HI FLOW THF 500 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.
■The reinforcement makes BERGQUIST HI FLOW THF 500 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.
■BERGQUIST HI FLOW THF 500 is tack-free and scratch resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.
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[ Spring/clip mounted ][ Power semiconductors ][ Power modules ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 2020 |
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63 KB |
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