BERGQUIST BOND PLY TBP 720LMS Known as BERGQUIST BOND-PLY LMS 1000 Technical Data Sheet
●Low Modulus Silicone, Heat Cured, Laminating Adhesive.
▲Technology:Acrylic
▲Appearance:Light brown
▲Total Thickness:0.2032 mm
▲Application:Thermal management, Thermally conductive adhesive
●BERGQUIST BOND PLY TBP 720LMS is a thermally conductive fiber reinforced heat curable laminating adhesive film. The product consists of a high performance, thermally conductive, low modulus silicone compound coated on a fiberglass weave and double lined with protective films.
●The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch or Shock and Vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity.
●BERGQUIST BOND PLY TBP 720LMS is typically used for fastening power components and printed circuit assemblies to heat sinks.
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thermally conductive fiber reinforced heat curable laminating adhesive film |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2018 |
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63 KB |
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