BERGQUIST BOND PLY TBP 400B
■ Silicone-Free Formulation, High Performance Thermally Conductive Material.
▲ Technology: Acrylic
▲ Appearance: White
▲ Reinforcement Carrier: PEN Film
▲ Total Thickness: 0.14 mm
▲ Application: Thermal management, Thermally conductive adhesive
▲ Operating Temperature Range: -30 to 120ºC
● FEATURES AND BENEFITS:
■ Designed to replace mechanical fasteners or screws
■ For applications that require electrical isolation
■ Double-sided, pressure sensitive adhesive tape
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[ Mount heat sink onto BGA graphic processor ][ Mount heat sink onto drive processor ][ Mount heat spreader onto power converter PCB ][ Mount heat spreader onto motor control PCB ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 2018 |
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63 KB |
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