GT8E-8/5P-2H(55) Drawing
● RECOMMENDED REFLOW PROF I LE C REF E R TO RIGHT Fig.).
▲ REFLOW HEATING: FAR-INFLARED. IN THE AIR OR NITROGEN.
▲ NUMBER OF REFLOW CYCLES: 2 TIMES
▲ PEAK TEMPERATURE: 250℃
▲ ABOVE 230℃: 20~40s
▲ PREHEAT: 150-180℃ (60~120s)
● SOLDERING TEMPERATURE; 280~300℃
● COPLANARITY OF LEADS SHALL BE UNDER 0.1mm
● RECOMMENDED THICKNESS FOR PCB IS 1.6nm
● RECOMMENDED THICKNESS FOR SOLDER PASTE IS 0.15mm
● PACKING SPECIFICATION IS SPECIFIED.
● ONE REEL INCLUDES 500 PRODUCTS. DELETED
|
|
|
|
Outline Dimension Drawing |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
20211119 |
|
|
|
|
|
EDC-166974-55-00 |
|
|
96 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
