GT8E-16DP-2H(55) Drawing
● 1. RECOMMENDED REFLOW TEMPERATURE PROFILE (REFER RIGHT FIG. )
▲ REFLOW HEATING: FAR-INFLARED, IN THE AIR OR NITROGEN
▲ NUMBER OF REFLOW CYCLES: 2 CYCLES MAX
▲ PEAK TEMPERATURE: 250 ℃
▲ ABOVE 230℃: 20~40 s
▲ PREHEAT: 150~180 ℃ (60~120 s)
● 2. SOLDERING TEMPERATURE: 280~300 ℃ (MAX 2s)
● 3. COPLANARITY OF LEADS SHALL BE 0.1 mm MAX.
● 4. RECOMMENDED THICKNESS FOR PC BOARD IS 1.6 mm.
● 5. RECOMMENDED THICKNESS FOR SOLDER PASTE IS 0.15 mm.
|
|
|
|
|
|
|
Outline Dimension Drawing |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
May.1.2021 |
|
|
|
|
|
EDC-167885-55-00 |
|
|
83 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
