Strain Gage Installation Checklist: Printed Circuit Assemblies

2022-07-14
●Strain Measurements on PCAs
■Advances in printed circuit assembly design and manufacturing, plus the requirement for lead-free solder, have resulted in a need to test PCAs to determine if the design can withstand the rigor of manufacturing, packaging, transporting, and day-to-day use of electronic devices. The electronics industry has produced standards, such as IPC/JEDEC 9704 and IPC/JEDEC 9702, which describe the methods in which strain gages are used for printed circuit assembly testing

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GC-6GSP-1SCP-3CSP-1M-PrepPCT-3MPDT-3C2AC5KC2KL2AWKC2A SeriesC5K SeriesC2K SeriesL2A SeriesWK SeriesC2A-06-G1350-120/SP70C2K-06-G1350-350/SP70C2A-06-031WW-350L2A-06-031WW-350C2A-06-062WW-350L2A-06-062WW-350WK-06-030WR-350WK-06-060WR-350C5K-06-S5198-350/33FC5K-06-S5198-350/39FC2A-06-015LW-120C5K-06-S5145-350-33FG1350S5198M-Bond 200BAK-200M-Coat AM-Coat CSeries 60006000

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GageStrain GagesWeldable GagesConcrete Embedment GagesSealed Weldable GagesAdhesiveProtective CoatingSignal Conditioning AmplifiersData SystemsStrain Indicatorscotton-tipped applicatorNeutralizerConditionergage installation tapedrafting tapesilicon carbide paper

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User's Guide

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Please see the document for details

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2018/3/29

MS0273-1803

1.7 MB

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