C8051F330-GDI Datasheet Revision Notification
●Description:
Version 1.2 of the C8051F330-GDI datasheet is now available. The revision includes the following changes:
-Updated Table 1.1, “Product Selection Guide,” on page 2 to include a no backgrind option.
-Updated Table 3.2, “Wafer and Die Information,” on page 7 to include a no backgrind option.
-Added “5. Failure Analysis (FA) Guidelines” on page 9.
●Reason:
C8051F330-GDI datasheet revision adds an option to order wafers without backgrind and adds failure analysis guidelines.
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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4/23/2014 |
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rev G |
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#1404231 |
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111 KB |
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