CTX Series High Frequency Wire Bondable Chip Terminations Product Launch Training
●There are several key market trends driving the future for board level components and Smiths Interconnects latest chip termination series addresses the next generation market needs mainly for Space communication systems. 5G and Defense applications.
■SWaP-C
■High Frequency - Up to 64 GHz
★Competition range 44GHz and 60GHz max
■High Density - Manufacturable in High Volume
★Smiths equipped for quick ramp up for large programs where competition struggles.
■ Aluminum Nitride Substrate
■ Total Thin Film Construction
■ Broadband (DC-64 GHz)
■ Excellent VSWR (1.25:1 Typical)
■ Capable of 5 watts CW input
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台www.sekorm.com |
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