Power Modules Win Out, but Choose Wisely
●Introduction
■Whether evaluating step-down switching regulators at the silicon-level (controller with FET), or power modules where the integration and ease of use of a more complete power supply subsystem may be preferred, system designers everywhere are under enormous pressure. They’re being tasked with integrating more power and features in ever-shrinking form factors, and thus adversely affecting the system’s electrical and thermal characteristics.
■There are various obstacles system designers must overcome on the path to integration nirvana. These include the increased likelihood of noise coupling as components are in closer proximity, as well as heat dissipation, given that the power-handling capabilities continue to increase along with smaller footprint areas.
■Fortunately, power module designers continue to innovate to meet these demanding requirements through various architectural and topological design approaches that extract the maximum performance from the smallest package. Yet, these innovations put the burden upon system designers in need of the optimum power module to be careful in their choice of solutions. The techniques used by different power module solutions can greatly affect overall system cost and key performance parameters such as heat dissipation, transient response, ripple voltage, and even ease of use. It’s very much a case of ‘buyer beware.’
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/07/10 |
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543 KB |
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