NCP51705 SiC MOSFETs: Gate Drive Optimization

2022-06-23
●INTRODUCTION
■Silicon carbide (SiC) is part of the wide bandgap (WBG) family of semiconductor materials used to fabricate discrete power semiconductors. As shown in Table 1, conventional silicon (Si) MOSFETs have a bandgap energy of 1.12 eV compared to SiC MOSFETs possessing 3.26 eV.
■The wider bandgap energy associated with SiC and (GaN) Gallium Nitride means that it takes approximately 3 times the energy to move electrons from their valence band to the conduction band, resulting in a material that behaves more like an insulator and less like a conductor. This allows WBG semiconductors to withstand much higher breakdown voltages, highlighted by their breakdown field robustness being 10 times that of silicon. A higher breakdown field enables a reduction in device thickness for a given voltage rating which translates to lower on−resistance and higher current capability. SiC and GaN each have mobility parameters on the same order of magnitude as silicon, making both materials well suited for high−frequency switching applications. However, the parameter most differentiating SiC is its thermal conductivity being more than 3 times greater compared to silicon and GaN. Higher thermal conductivity translates to lower temperature rise for a given power dissipation. The guaranteed maximum operating temperature for commercially available SiC MOSFETs is 150°C < T-J < 200°C. Comparatively, SiC junction temperatures as high as 600°C are attainable but mostly limited by bonding and packaging techniques. This makes SiC the superior WBG semiconductor material for high−voltage, high−speed, high−current, high−temperature, switching power applications.
■SiC MOSFETs are commonly available in the range of 650 V < BVDSS <1.7 kV, with the majority focus being 1.2 kV and above. At the lower range of 650 V, traditional silicon MOSFETs and GaN outperform SiC. However, one reason to consider lower voltage SiC MOSFETs might be to take advantage of their superior thermal characteristics. Although the dynamic switching behavior of SiC MOSFETs is quite similar to standard silicon MOSFETs, there are unique gate drive requirements dictated by their device characteristics that must be taken into consideration.

ON Semiconductor

NCP51705

More

Part#

SiC MOSFETs

More

More

Datasheet

More

More

Please see the document for details

More

More

TO−220;TO−247

English Chinese Chinese and English Japanese

2022/5/4

Rev. 2

TND6237/D

2.3 MB

- The full preview is over. If you want to read the whole 23 page document,please Sign in/Register -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: