INTRODUCING LGA 3647 SOCKET & HARDWARE
●Meet future design needs with LGA 3647 sockets and hardware to meet Intel’s next-generation CPU processors
●Provide higher performance, better system application scaling and better value
●TE Connectivity’s (TE) LGA 3647 socket and hardware meet the next-generation designs of Intel Corporation’s (Intel) new CPU processors for higher performance and better system scaling. LGA 3647 socket is the first to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability. As one of a limited number of suppliers offering LGA 3647, TE has both socket and hardware parts available to bring you a full solution.
●KEY BENEFITS
■Meet future design needs with LGA 3647 sockets and hardware that meet Intel’s next-generation CPU processors
■Provide higher performance, better system application scaling and better value with new socket and hardware design
■Offer better coplanarity and reliability with a two-piece design that improves issues with warpage
■Help improve alignment and keep fingers away from the socket contact field with fabric and non-fabric carrier hardware
■Assist in orientation and alignment for the processor heatsink module (PHM) and the spring load force necessary for socket loading with the bolster plate hardware
■Supply mounting points for the bolster plate with back plate hardware
|
[ Servers ][ Storage ][ Data centers ][ High-performance computing ] |
|
|
Technical Documentation |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2018/01/06 |
|
|
|
|
|
|
|
|
255 KB |
- +1 Like
- Add to Favorites
Recommend
- TE Connectivity to acquire antennas business from Laird Connectivity
- Wind Farms On-and Off-shore Reduces Installation Time with TE Connectivity’s New Easy-to-use High Voltage Joints (PHVJ)
- TE Connectivity Acquires Smart Grid Company Kries, Expanding TE’s Smart Grid Monitoring, Protection, Automation Capabilities
- TE Connectivity and Sekorm Reached A Strategic Cooperation on the Connector Business
- TE Connectivity‘s Raychem USB 3.1 cable provides up to 10 Gb/s data rates and Jacket elongation of 200% minimum
- TE Connectivity Acquires ERNI Group AG
- TE Connectivity Launches First-to-market SolderSleeve Device for Space
- TE Connectivity begins expansion of ERNI facility in Germany
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
