51390-XXXXX-XXX 1.25m WTB Wafer SMT D/R S/T type
■HOUSING: THERMOPLASTIC(PA9T), HIGH TEMP，UL94V-0
■CONTACT: COPPER ALLOY
■FITTING NAIL: COPPER ALLOY
●FINISH:
■CONTACT: 50u" MIN. NICKEL UNDERPLATING OVERALL
▲1: GOLD FLASH PLATING.
▲C:15u" GOLD ON CONTACT AND GOLD FLASH SOLDER AREA
■FITTING NAIL: 50u" MIN. NICKEL UNDERPLATNG OVERALL.
▲N:80u" MIN. MATTE TIN PLATING
●REFLOW SOLDER CAPABLE TO 260℃ PER ACES SPEC.
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Outline Dimension Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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21/05/06 |
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REV.C |
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51390-XXXXX-XXX |
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131 KB |
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