50315-XXXXX-XXX 2.0mm PITCH WTB WAFER T/H R/A TYPE
■HOUSING: THERMOPLASTIC, HIGH TEMP., UL94V-0; COLOR:BLACK.
■CONTACT: COPPER ALLOY
● FINISH:
■CONTACT:
▲50u" MIN. NICKEL UNDERPLATING OVER ALL,
▲L: 80~120u MIN. PURE TIN PLATING OVER ALL
▲1: Gold Flash over all.
▲N: 50u" MIN MATT TIN OVERALL
■HITTING NAIL:
▲50u" MIN. NICKEL UNDERPLATING OVER ALL,
▲L: 80~120u" MIN. PURE TIN PLATING OVER ALL
▲N: 50u" MIN MATT TIN OVERALL.
●REFLOW SOLDER CAPABLE TO 260℃ PER ACES SPEC.
●WAVE SOLDER CAPABLE TO 260℃ PER ACES SPEC.
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Outline Dimension Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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17/07/18 |
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REV.B |
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50315-XXXXX-XXX |
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149 KB |
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