G125-F1XXXXX-XXX-XXX G125 LATCHED FLEX PCB ASSEMBLY Customer Information Sheet
■BOARD CONSTRUCTION:
▲SINGLE LATER FLEXIBLE PCB
▲50μm BASE POLYIMIDE
▲35μm (loi) COPPER CLAD TO IPC-4204/1
▲50μm BONDED COVERLAY TO IPC-4203/1
▲0.8mm HTG FR4 TO I PC - 4101/126 LOCALLY RIGIDISED IN CONNECTOR AREAS
■SURFACE FINISH:
▲ENIG TO IPC-4552 ON EXPOSED COPPER
■IPC LASSIFICATION:
▲BARE CIRCUIT - IPC-A-600/IPC-6013 CLASS 3
▲ASSEMBLY - IPC-A-610/J-STD-001 CLASS 3
■MECHANICAL PR0PER1IES:
▲MINIMUM FLEX THlCKNESS: C. lSST.ni
▲MINIMUM STATIC BEND RADIUS (IPC - 2223) : 1.85mm
▲SUITABLE FOR DYNAMIC OPERATION ON BEND RAD 11 ABOVE 3.70mm
■ELECTRICAL PROPERTIES:
▲MAX. CURRENT PER TRACK: 0.4A
▲INSULATION RESISTANCE: I0GΩ MIN AT 500V DC
▲VOLTAGE PROOf IAT 1013mbor, SEA LEVEL): 600VDC OR AC PEAK
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G125-F1XXXXX-XXX-XXX 、 G125 、 G125-MS1XX05L3P 、 G125-FS1XX05L0P |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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06.05.21 |
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ISS.5 |
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G125-F1XXXXX-XXX-XXX |
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198 KB |
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