G125-F1XXXXX-XXX-L G125 LATCHED FLEX PCB ASSEMBLY Customer Information Sheet
■BOARD CONSTRUCTION:
▲SINGLE LAYER FLEXIBLE PCB
▲50μm BASE POLYIMIDE
▲35μm (loz) COPPER CLAD TO IPC-4204/1
▲50μm BONDED COVERLAY TO IPC-4203/1
▲0.8mm HTG FR4 TO IPC-4I0I/126 LOCALLY RIGIOISED IN CONNECTOR AREAS
■SURFACE FINISH:
▲ENIG TO IPC-4552 ON EXPOSED COPPER
■IPC CLASSIFICATION:
▲BARE CIRCUIT - I PC-A-600/1PC-60I 3 CLASS 3
▲ASSEMBLY - I PC-A-6I 0/J-STO-00I CLASS 3
■MECHANICAL PROPERTIES:
▲NOMINAL FLEX THICKNESS - 0.185mm,
▲MINIMUM STATIC BEND RADIUS (IPC-2223) = I.85mm
▲SUITABLE FOR DYNAMIC OPERATION ON 8EN0 RADI 1 ABOVE 3.70mm
■ELECTRICAL PROPERTIES:
▲MAX. CURRENT PER TRACK = 0.4A
▲INSULATION RESISTANCE = lOGΩ MIN AT 500V DC
▲VOLTAGE PROOF (AT 1013mbar, SEA LEVEL) ： 600V DC OR AC PEAK
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G125-F1XXXXX-XXX-L 、 GI25-MS1XX05L3P 、 GI25-FS1XX05L0P 、 GI25-MF11005L3-0075L 、 G125-MS11005L3P |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2020/4/24 |
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106 KB |
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