Encapsulation process change on the TBGA package variants of PC8245/8260/8265 product family (GC191443)
●Reason for Change: Process Material; Assembly Material
●Change Description:
■Teledyne e2v aligns with NXP announcement ref. 201803021F01.
◆TBGA Package encapsulation process change from Glob Top to Center Gate Mold.
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PC8245MTPU300D 、 PC8245MTPU333D 、 PC8245MTPU350D 、 PC8260AMTPUMHBB 、 PC8260AMTPUMHBBZG2 、 PC8265AMTPUMHBC 、 PC8245 、 PC8260 、 PC8265 |
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PCN/EOL |
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Please see the document for details |
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TBGA |
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English Chinese Chinese and English Japanese |
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29 April 2019 |
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Rev L |
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GC191443 |
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98 KB |
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