Encapsulation process change on the TBGA package variants of PC8245/8260/8265 product family (GC191443)
●Reason for Change: Process Material; Assembly Material
●Change Description:
■Teledyne e2v aligns with NXP announcement ref. 201803021F01.
◆TBGA Package encapsulation process change from Glob Top to Center Gate Mold.
|
PC8245MTPU300D 、 PC8245MTPU333D 、 PC8245MTPU350D 、 PC8260AMTPUMHBB 、 PC8260AMTPUMHBBZG2 、 PC8265AMTPUMHBC 、 PC8245 、 PC8260 、 PC8265 |
|
|
|
|
|
|
|
|
PCN/EOL |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
TBGA |
|
|
English Chinese Chinese and English Japanese |
|
|
29 April 2019 |
|
|
Rev L |
|
|
GC191443 |
|
|
136 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
