Migration of PC5674F to TSMC wafer fab and Copper Wirebond Product Change Notification (GC183122)
●Reason for Change: Manufacturing Location; Material
●Change Description:
■In order to rationalize its procurements, Teledyne e2v aligns with NXP announcement ref. 16151.
◆The primary NXP wafer manufacturing site transfer to TSMC14 will improve ability to meet customer demand.
◆The transfer from Gold to Copper wire is required to standardize manufacturing flows and mitigate against raw material cost increases
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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25 September 2018 |
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Rev L |
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GC183122 |
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180 KB |
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