Memory Thermal Management 101
■ With the continuing industry trends towards smaller, faster, and higher power memories, thermal management is becoming increasingly important. Not only are device sizes shrinking, but the PC boards they mount onto are also shrinking. Placing devices closer and closer together helps lower overall system size and cost and improves electrical performance, but increases the “power density”, which can lead to higher device temperatures and, thus, to lower component reliability.
■ This paper describes GSI Technology's use of standardized thermal resistance data, methods for assessing a device's critical thermal parameters in a system application, and how thermal parameters are related to reliability.
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FAQ |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2012/4/25 |
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601 KB |
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