LITMAS® RPS 1501 AND 3001: INTEGRATED PLASMA SOURCE AND POWER-DELIVERY SYSTEM

2022-03-14
●The Litmas® Remote Plasma Source (RPS) delivers high concentrations of reactive gas species to enable advanced process applications, such as thin-film deposition, wafer pre-clean, photoresist strip, and abatement. Its small footprint, high performance, ease of use, and low cost of ownership allow you to focus on developing critical plasma-based processes with lower device damage, higher throughput, and higher yields.
●Features
■Delivers reactive gas species to the process chamber
■Provides the highest available plasma power density
■Uses durable SiO2 or Al2O3 chamber materials
■Uses patented LitmasMatch™ solid-state power-delivery topology
■Integrates the power supply, match, and plasma chamber in one package
●Benefits
■Reduces charge damage tofragile device structures, enabling higher yields
■Generates high reactive specie fluxes, delivering higher process rates
■Broadens the range of process chemistries, enabling a wide range of applications
■Provides fast matching, stable power delivery for precise process control
■Comprises one small-footprint package, providing reduced CoO

Advanced Energy

LB-1501LB-3001

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Remote Plasma Source (RPS) delivers

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WAFER PRE-CLEAN ]PVD pre-clean ]CVD pre-clean ]SACVD pre-clean ]LPCVD pre-clean ]Epitaxial growth ]Molecular beam epitaxy Photoresist Strip ]Photoresist strip (ashing) by reactive, ]oxygen-bearing gases ]plasma-enhanced etching ]THIN-FILM DEPOSITION ]PEALD ]PECVD ]PEPVD ]PERIE ]Liner film deposition ]barrier film deposition ]Epitaxial deposition ]Nitridation ]oxidation ]deposited films ]Conductor etch ]Dielectric etch ]

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Datasheet

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Please see the document for details

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English Chinese Chinese and English Japanese

2018/6/26

ENG-LitmasRPS-230-07

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