BERGQUIST LIQUI BOND TLB SA1800 Technical Data Sheet
■ High Thermal Conductivity: 1.8 W/m-K
■ Eliminates need for mechanical fasteners
■ Low viscosity for ease of screening or stenciling
■ Maintains structural bond in severe environment applications
■ Heat cure
● PRODUCT DESCRIPTION:
■ Thermally Conductive, One-Part, Liquid Silicone Adhesive.
■ Technology: Silicone
■ Appearance: Black
■ Cure: Heat cure
■ Application: Thermal management, TIM (Thermal Interface Material)
■ Operating Temperature Range: -60 to 200ºC
■ UL Flammability Rating: UL 94 V-0
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BERGQUIST LIQUI BOND TLB SA1800 、 BERGQUIST LIQUI-BOND SA 1800 |
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[ PCB assembly to housing ][ Discrete component to heat spreader ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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January 2019 |
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69 KB |
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