Building Arrays of ON Semiconductor SiPM Sensors
●This document focusses on the creation of close-packed arrays of SiPM sensors. It gives both general advice and describes the design and test of a 12 x 12 (144) pixel array using 3 mm surface mount SiPM sensors. Primarily., the design was carried out to investigate the achievable pixel pitch and planarity when producing arrays using these devices. To evaluate the functionality of the arm}7, it was decided to design the board to have the necessary output to be compatible with the Matrix readout system which allowed for perfonnance testing of the array. Although the work here uses the MLP type of surface mount sensor package, all of the information applies equally to the creation of arrays using ON Semiconductor TSV packaged parts.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/8/6 |
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Rev. 3 |
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AND9777/D |
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1.5 MB |
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