Amphenol TCS Printed Circuits：Via FormationBackground and Considerations

PublishTime：2022-01-18

■As technology continues to advance, electronicdevices become smaller and faster. These increases inpackaging density and performance challengedesigners and manufacturers to develop new meth-ods of upping the density of printed circuit boards(PCBs) without increasing total system cost. Via-in-Pad Technology is one routing strategy that canaddress the need for high-density signals on PCBs.
■Via-in-Pad Technology is used to open up routingchannels on the surface of the board. Holes aredrilled into the center of the SMT pad and then plat-ed, filled with a thermal set epoxy based material,and over plated again, to provide a smooth surface.This process has electrical benefits and provides athermal barrier during assembly.
■Via-in-Pad Technology improves routing density byeliminating through vias, thus allowing additionalrouting per channel. A via is drilled directly into theBGA pad, creating a dimple within the pad. As theBGA is assembled, the goal is to fill the dimple withsolder paste and solder. If air or volatiles get trappedwithin the via, it can cause voids and outgassing dur-ing assembly. In order to eliminate this problem, viascan be filled with conductive or non-conductiveepoxy and planarized.

Brand of Product：	Amphenol ICC
Part#：
Product Category：	TCS Printed Circuits More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2006/8/25
Version Number：
Data Encoding：
Data Size：	628 KB

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Integrated Circuits