Enabling the 5G RF front-end module evolution with the DSMBGA package

PublishTime：2021-12-30

With the rise of 5G wireless technology, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of radio frequency (RF) front-end (RFFE) modules for smartphones and other 5G-enabled devices. Our double-sided molded ball grid array (DSMBGA) is an example of such solutions. Double-sided packaging technology has vastly increased the level of integration for RF front-end modules used in smartphones and other mobile devices. Common RF front-end modules consist of a low noise amplifier (LNA), power amplifier (PA), an RF switch, RF fi lters and duplexers.

Brand of Product：	AMKOR
Part#：
Product Category：	RF front-end module 、 radio frequency (RF) front-end (RFFE) modules More
Application：	More
Data Type：	Technical Documentation More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	DSMBGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	October 2021
Version Number：
Data Encoding：
Data Size：	5.6 MB

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