ISL22316WFU10Z-TK single digitally controlled potentiometer (DCP) SGS TEST REPORT
This data is presented in the form of compressed package with SGS test report of ISl22316WFU10Z-TK attached.
SAMPLE DESCRIPTION:
●Au BONDING WIRE
●MEP AG PLATING LEADFRAME C194 (AG PLATING, MEP AG PLATING, MEP NO PLATING, NO PLATING & COPPER CLIP)
●EPOXY MOLDING COMPOUND
●One (1) 200mm die-patterned wafer
●PURE TIN SOLDER, Sn
●ADHESIVE
|
|
Test Report |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
2021/12/01 |
|
|
|
|
|
9.6 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.