Product Information: Allegro Package Designations
●INTRODUCTION
■This document provides reference information as an aid to differentiating the device package types used by Allegro™ MicroSystems. It provides cross-references to the package designation, an Allegro code that is integrated into the device part number:
▲alphabetical listing of Allegro package designators, with differentiating specifications and reference illustrations
▲alphabetical listing of common or obsolete package designators, cross-referenced to Allegro designators
▲key to interpreting Allegro part numbers for package designators
▲key to interpreting Allegro terms for lead forms
■The package designator is used to differentiate the external physical characteristics of the packages for ordering purposes.
■To use this document, in the Allegro Package Code column, locate the package designator for the device. Alternatively, use the drawings to identify a package, or the cross-reference to common terms.
■A few package types have leadform options. These options are indicted by the instruction codes, shown in parentheses in the Package Designation column. Lead-form options are shown in separate rows. Leadform options are not always available for every device type.
■The options available for any specific device are substantially determined by the package designation for that device. Not all options are available for any particular package designation or device type, and provision of certain configurations may be subject to minimum volume or NCRN (noncancellation, nonreturn) limitations.
■For clarity and differentiation, the drawings are schematic and not to scale, however, a representative footprint is provided at approximately actual size of the package body when mounted on a PCB. The drawings do not represent all possible configurations of that device, or any particular device, and may have features that vary according to supplier preference within specifications, such as pin 1 index marks. Exposed thermal pads may have several alternative layouts for any particular package designation.
■When applicable, references to industry-standard type conventions, such as JEDEC package registrations, are provided. These references are for informational purposes only, and do not necessarily indicate that the device indicated conforms fully with those standards in all respects.
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Package Information |
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Please see the document for details |
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DIP;PDIP;DIL;PFF;PSF;PSS;WLCSP;PLCC;PQCC;MLPQ;QFN;MLPD;DFN;SON;LQFP;eLQFP;TQFP;eTQFP;SIP;SOIC;SOP;SOIC-W;TSSOP;SOT23W-3;SOHED;PSOF;SOT89;SC-62;CSP;QSOP;SOIC-N;SOT23;SOT23-W;HED;HTSSOP;PDIL;PQFN;PSON;TDFN |
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English Chinese Chinese and English Japanese |
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September 19, 2019 |
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Rev. 6 |
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MCO-0000225 |
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1010 KB |
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