Power Module：Optimized heat sink assembly method for effective heat dissipation

PublishTime：2021-10-21

●Power modules are widely used in inverter and motor drive applications. Inside the module the semiconductor devices dissipate heat from conductive loss and switching loss. Therefore, it is necessary to consider in the design the heat dissipation mechanism. This application note shows the optimized assembly of power modules to heatsinks and presents the effect of optimized mounting on effective dissipation of heat from the module to the heat sink.

Brand of Product：	ROHM
Part#：
Product Category：	Power modules More
Application：	[ inverter and motor drive applications ] More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2020.12
Version Number：	Rev.001
Data Encoding：	63AN154E
Data Size：	2.7 MB

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