TO-220FP
■Features
●Cu Clip interconnect for better heat dissipation efficiency
●Mounted package height reduced by 2.8 mm vs. standard TO-220NIS
●Turnkey with test and packing services
●Green materials: Pb-free plating & halogen free mold compound
■New Developments
●Larger/higher density leadframe strips
●Environmentally friendly Pb-free solder paste
■Process Highlights
●Bare copper leadframe with no plating
●Interconnect: Cu clips for better electrical and thermal performance
●Plating: 100% matte Sn
●Marking: Pen type lase
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[ Switching power supplies ][ AC adapters ][ Motor drivers ][ Flat panel display ] |
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Package Information |
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Please see the document for details |
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TO-220FP;TO-220;TO-220NIS |
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English Chinese Chinese and English Japanese |
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10/18 |
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Rev : 10/18 |
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DS610C |
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922 KB |
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