TO-220FP

2021-10-21
■TO-220FP (Full Pak) is a full-pack version of TO-220, which has a better heat dissipation efficiency through Cu clip structure, and with mounted package height reduced by 2.8 mm compared to conventional TO-220NIS package.
■Features
●Cu Clip interconnect for better heat dissipation efficiency
●Mounted package height reduced by 2.8 mm vs. standard TO-220NIS
●Turnkey with test and packing services
●Green materials: Pb-free plating & halogen free mold compound
■New Developments
●Larger/higher density leadframe strips
●Environmentally friendly Pb-free solder paste
■Process Highlights
●Bare copper leadframe with no plating
●Interconnect: Cu clips for better electrical and thermal performance
●Plating: 100% matte Sn
●Marking: Pen type lase

AMKOR

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Switching power supplies ]AC adapters ]Motor drivers ]Flat panel display ]

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Please see the document for details

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TO-220FP;TO-220;TO-220NIS

English Chinese Chinese and English Japanese

10/18

Rev : 10/18

DS610C

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