Surface Mount Guidelines for Amkor Dual Row MicroLeadFrame®(DRMLF®) AN3015

PublishTime：2021-12-30

This application note provides guidelines for surface mount technology (SMT) assembly of Amkor’s Dual Row MicroLeadFrame® packages (DRMLF®) using prevalent practices in the SMT industry and standards such as IPC and JEDEC. It includes recommendations for printed-circuit board (PCB) landpad design, stencil design, mounting, reflow profile and rework processes.

Brand of Product：	AMKOR
Part#：
Product Category：	More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	October 2018
Version Number：	Rev B1
Data Encoding：	AN3015
Data Size：	514 KB

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