Gen-Z™ Memory Module (ZMM)
●Product Description
■Gen-Z Form Factor 4C-SFF-TA-1008/9 (EDSFF 3-inch form factor compliant)
■Available in 64GB capacity of dual rank DDR4 memory with ECC
■Available in user-programmable FPGA variant to allow adding custom logic for differentiation, or add hardware engines in FPGA, which can offload specific functions to memory module, right next to where data resides.
●Why the ZMM?
■New Type of Design Challenges
◆The increase in number of CPU cores has not been matched by an increase in memory bandwidth leading to memory bandwidth starved CPU cores. By being able to support more memory interfaces and memory modules Gen-Z serial attached ZMM memory increases memory bandwidth per core increasing system performance.
◆Gen-Z ZMM memory provides load-store direct addressing to memory by applications eliminating operating system and device driver overhead. CPU cores spend more time executing end applications.
■Workloads Are Changing
◆Latest HPC models and AI/ML algorithms require large pool of memory to store intermediate data sets. These data sets require concurrent access from multiple compute nodes. Thus such workloads need large pool of shared memory, independent of any compute node.
■New Generation of Hardware
◆As network speeds are increasing, the latency difference between local attached memory and remotely accessible memory is decreasing. Addition of specialized hardware accelerators.
●Features & Benefits
■Multiple Access Semantics Support (Byte and Block Addressable DRAM Access, In-Band Configuration, Access Key/Region Key Memory Isolation Opcodes)
■Gen-Z Phy Support (16 Total Links - 4x, 4-Lane Links, 802.3 25Gbps), with 4 Requestor and 4 Responder Configuration
■Write Command Collision Detection and Ordering Logic with Support for 9 to 11 Cycles of CAS Write Latency at 2400 MTS
■Media Scrubbing (Background ECC Detection and Correction)
■Gen-Z Lane Reduction Support
●Applications
■In-Memory Analytics
■Similarity Search
■Large-Scale Graph Inference
■Financial Modeling
[ In-Memory Analytics ][ Similarity Search ][ Large-Scale Graph Inference ][ Financial Modeling ] |
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
09.23.21 |
|
Rev.5 |
|
|
|
798 KB |
- +1 Like
- Add to Favorites
Recommend
- [应用]25A/40V德欧泰克SBX2540-3G太阳能旁路二极管用于光伏电池板,泄漏电流低仅200μA
- 使用压接技术生产IGBT有哪些优势?∣视频
- 蓝牙SOC芯片是无线通信技术的核心力量
- [经验]瑞萨32位MCU RA2E1如何利用FSP工具生成sci_uart的配置代码
- SMART Announces SMART Zefr Memory with Ultra-High Reliability Performance for Demanding Compute Applications
- SMART‘s DDR4 Modules Range From 32GB To 4GB, 20% Lower Overall Power Vs. DDR3
- SMART New SSD Solutions Are Ideally-suited for Government and High-security Applications
- SMART Modular Expands DuraMemory™ Offerings with Proprietary DIMM Retention Device for Harsh Operating Environments
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.