STM32MP157C/F - Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto
■Includes ST state-of-the-art patented technology
■Core
■Memories
■Security/safety
■Reset and power management
■Low-power consumption
■Clock management
■General-purpose input/outputs
■Interconnect matrix
■3 DMA controllers to unload the CPU
■Up to 37 communication peripherals
■6 analog peripherals
■Graphics
■Up to 25 timers and 3 watchdogs
■Hardware acceleration
■Debug mode
■3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
■All packages are ECOPACK2 compliant
●Description
■The STM32MP157C/F devices are based on the high-performance dual-core Arm®Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9
■The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
■The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm®single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
■The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
■The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
■The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
■All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
■A comprehensive set of power-saving mode allows the design of low-power applications.
■The STM32MP157C/F devices are proposed in 4 packages ranging from 257 to 448 balls with pitch 0.5 mm to 0.8 mm. The set of included peripherals changes with the device chosen.
■These features make the STM32MP151A/D suitable for a wide range of consumer, industrial, white goods and medical applications.
■shows the general block diagram of the device family.
|
STM32MP157C 、 STM32MP157F 、 STM32MP157CADxx 、 STM32MP157FADxx 、 STM32MP157CABxx 、 STM32MP157FABxx 、 STM32MP157CACxx 、 STM32MP157FACxx 、 STM32MP157CAAxx 、 STM32MP157FAAxx 、 STM32MP157FAA1T |
|
|
[ high-end wearables ][ low-power embedded applications ][ consumer applications ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
LFBGA448;LFBGA354;TFBGA361;TFBGA257 |
|
|
English Chinese Chinese and English Japanese |
|
|
17-May-2021 |
|
|
Rev 6 |
|
|
DS12505 |
|
|
3.5 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
