MICRO PMT ASSEMBLY MICRO PMT MODULES MICRO PMT PHOTON COUNTING HEAD
■Tiny dimensions
●Micro PMT has a three-layer structure where a silicon substrate is sandwiched between two glass substrates. Utilizing only three components gives tiny dimensions impossible up until now.
■Easy to mass produce
●Micro PMT can be produced in high volume while still maintaining high reliability and performance. What makes this possible is overall integrated usage of our in-house advanced technologies for MEMS (micro-electro-mechanical systems), semiconductor manufacturing, electron trajectory design, vacuum sealed packaging, and vacuum processing.
■High shock resistance
●Micro PMT devices offer strong shock resistance since anodic bonding by MEMS technology is utilized to join the silicon substrate to the glass substrates. This high cushioning or shock resistance makes them ideal for developing high-performance, hand-held testing and analysis devices.
■High sensitivity and fast response
●Micro PMT utilizes the same high precision structure for electrode arrangement as conventional PMTs and so provides the high sensitivity and fast response needed from a PMT.
■Customizing support
●Feel free to consult with us on customizing to match customer usage conditions and environment.
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H12400-00-01 、 H12400-01-01 、 H12402 、 H12402-01 、 H12403 、 H12403-01 、 H12406 、 H12406-01 、 H12400 、 H12400 SERIES 、 H12403 SERIES 、 H12402 SERIES 、 H12406 SERIES 、 E13561 、 E13562 、 E13563 、 E13564 、 C10940 、 C10940 SERIES 、 C10940-03 、 C10940-03-R2 、 C10940-53 、 C10940-53-R2 、 C10709 、 C7319 、 C9683 、 C6438 、 C11184 、 C5594-44 、 C9744 、 C8855-01 |
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MICRO PMT ASSEMBLY 、 MICRO PMT MODULES 、 MICRO PMT PHOTON COUNTING HEAD |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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SEPT.2016 |
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TPMZ1019E03 |
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1.2 MB |
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