PA210009(R3):Die Thickness Change and Add Additional Manufacturing Locations for DDR5 RCD
■Renesas is changing the die thickness from 8mil to 10mil for better warpage performance. Internal qualification on the first lot has been successfully completed. Refer attach Qualification report.
Refer attachment for more details on die thickness changes.
■In addition, we are adding few manufacturing locations for this product as shown below to allow manufacturing flexibility and achieve minimal dual source. No change to foundry location.
■There will be no change in the moisture sensitive level.
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5RCD0148HC3AVG 、 5RCD0148HC3AVG8 、 5RCD0148HC3AVGI 、 5RCD0148HC3AVGI8 、 5RCD0148 |
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PCN/EOL |
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Please see the document for details |
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FCCSP 240 |
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English Chinese Chinese and English Japanese |
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9/15/2021 |
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Revision 3 |
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PA210009(R3) |
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1.2 MB |
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