Bodo's Power systems® ClearPower Modules Tackle Designers' Toughest Challenges

PublishTime：2021-09-14

● There are fundamental truths that every system designer must face when it comes to power electronics. First, most projects will need multiple rounds of design, simulation, and trial to pass strict limits on EMI (electromagnetic interference). Second, there is the issue that introducing EMI components will reduce system efficiency and add to cost and solution size. This latter point is particularly pertinent as there is often very little board space reserved for the power solution, so the option of using large, proven solutions is no longer valid. Finally, the thermal environment will generally be worse than anticipated.
● Fortunately, where this situation was once little short of dire, recent developments in integrated circuit design, system integration and packaging are serving to lighten the power designer's load. In fact, it is now possible to consistently deliver high-quality designs that pass the strict limits of CISPR 25 Class 5 or EN 55025, while simultane-ously reducing overall solution size and managing thermal dissipation.
● Allegro MicroSystems' ClearPower module family of products, which adopt a 'system in a package' approach, provide the answer that designers have been seeking for some time. ClearPower modules house all the principal elements of a high-performance switching power supply or LED driver within a compact package, significantly easing the task of designing complete power solutions.
● An example of a recently developed ClearPower module is Allegro's APM80900 (Figure 1), which is intended for LED lighting applications. A power inductor, critical bypass capacitors and an advanced switch-ing regulator IC are co-packaged within an envelope that measures just 4 × 6 × 2 mm, while routable substrate technology is employed to connect the various sub-components together, and to the outside world.
● By co-locating these critical power stage components within close confines, the high current switching paths that promote EMI are reduced by a factor of 10. Additionally, through direct integration and innovative IC design, overall size can be up to 70% less compared with conventional solution.
● Allegro MicroSystems' ClearPower modules feature an MIS (molded interconnect substrate) routable lead-frame package with the look and feel of a conventional QFN solution. Combining this technology in an industry-standard QFN footprint with wettable flanks ensures reliable operation at the harshest of automotive operating temperatures.
● While the task of developing a viable power solution that will pass EMI limits has become far easier with power modules, achieving high performance demands a holistic approach to the design of the module itself. This undertaking involves combining IC design, packaging technology and passive component integration to achieve the desired EMI, thermal performance and size.

Brand of Product：	ALLEGRO
Part#：	APM80900 More Part#
Product Category：	ClearPower module 、 power More
Application：	[ LED lighting ][ power electronics ] More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	July 2020
Version Number：
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Data Size：	953 KB

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