CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor,Through Hole Network (Custom)

PublishTime：2021-09-06

■A dual-in-line monolithic ceramic package in a variety of sizes and configurations. A rugged, low cost packaging technique with 4 leads to 20 leads that allows higher resistance integration than chip and wire ceramic packages.
■FEATURES
●Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
●Monolithic construction
●Ceramic package with no cavity. 4 pins to 20 pins.
●Flexibility of lead variations to save PC board space

Brand of Product：	VISHAY
Part#：	CSD 、 CSD1xx-xxxBX 、 CSD1xx-xxx-xBX More Part#
Product Category：	Ceramic Sandwich, Dual-In-Line Thin Film Resistor More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	17-Mar-2020
Version Number：	Revision: 17-Mar-2020
Data Encoding：	60046
Data Size：	101 KB

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