SG5127RD325893HB DDR3 REGISTERED ECC DIMM Memory Test Lab Report
■Manufacturer Name: SMART MODULAR TECH
■Manufacturer P/N: SG5127RD325893HB
■Memory Capacity: 4GB
■Module Configuration: 6 PER CPU/12 TOTAL
■DRAM Supplier: HYNIX
■DRAM Part Number: H5TQ2G83BFR-H9C
■PCB Part Number: PH5AG240NEBHB2RB A
■PCB Layer Count: 6
■Module Type: DDR3 REGISTERED ECC DIMM
■CAS Latency: C999
■Assembly Type: SINGLE BOARD NON STACKED
■Low Profile: NO
■Register P/N: IDT IDTSSTE32882-HLBAKG
■PLL P/N: N/A
|
SG5127RD325893HB 、 H5TQ2G83BFR-H9C 、 PH5AG240NEBHB2RB A 、 S5520SCR |
|
|
|
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2021/07/22 |
|
|
|
|
|
SMTL0038 |
|
|
69 KB |
- +1 Like
- Add to Favorites
Recommend
- SMART Announces SMART Zefr Memory with Ultra-High Reliability Performance for Demanding Compute Applications
- SMART‘s DDR4 Modules Range From 32GB To 4GB, 20% Lower Overall Power Vs. DDR3
- SMART New SSD Solutions Are Ideally-suited for Government and High-security Applications
- SMART Modular Expands DuraMemory™ Offerings with Proprietary DIMM Retention Device for Harsh Operating Environments
- September 2023 Marked A Year Since SMART Launched SMARTsemi
- SMART Modular Announces New Memory Solutions for Data Center Networking Applications
- SMART Modular Introduces eMMC for Industrial Embedded Applications
- SMART Modular Introduces MDC7000 Enterprise-Class Solid State Drive
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
