IT3D-300S-BGA(39) Drawing
● 1. IT3D receptacle to be mated and unmated with IT3-300P-**H(**).
● 2. Lot no. is marred top of the connector.
● 3. Minimum clearance for all devices.
● 4. Minimum clearance for all sensitive devices.
● 5. More information of this product is available in HIROSE document: ETAD-F0347 "IT3 Design Guideline" .
● 6. Maximum coplanarity of the ball field is 0.18 mm.
● 7. Standard package of 48pcs are packaged in a carton box.
● 8. This product is recommended to be used within four weeks after unpacked due to the possibility of oxidation of BGA.
● 9. This product is a solder ball locations and co planarity sensitive BGA connector.
▲ It is recommended to handle this product with the automated machine.
▲ Solder ball locations and co planarity might be damaged accidentally when it is manually handled by assembly workers.
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Outline Dimension Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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20181219 |
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EDC3-157108-05 |
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497 KB |
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