TJC Series – Thermal Jumper Chip
●High thermal conductivity
●Electrically isolated
●Aluminium nitride (AlN) ceramic
●Compact thermal management
■FEATURES
●Thermal resistance down to 4.6°C/W
●Thermal conductivity up to 218mW/°C
●I5x thermal conductivity of alumina
●solation clearance up to 4.3mm
●Non‐tracking ceramic surface
●Capacitance down to 0.05pF
●10 sizes from 0603 to 2512
●Pb‐free and SnPb options
●Higher thermal conductivity than the equivalent footprint of 70μ copper
■BENEFITS
●Low thermal resistance keeps electronic assembly cooler and therefore enhances product reliability
●Compact design minimizes PCB area and total assembly size
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[ hot spot reduction in compact, high power density designs ][ Power supplies ][ Power amplifiers ][ RF amplifiers ][ Laser diode cooling ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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