PCN #203: All devices manufactured in the SOIC-8 package（The composition of the bond wire is changing from Gold (Au) to Copper/Palladium/Gold (CuPdAu).）
■All devices manufactured in the SOIC-8 package.
●Extent of Change:
■The composition of the bond wire is changing from Gold (Au) to Copper/Palladium/Gold (CuPdAu).
●Reason for Change:
■This change will insure an uninterrupted flow of product and provide increased flexibility for supply chain management.
●Effect of Change:
■This change does not affect the form, fit, or function of any device.
●Qualification:
■Based on standards JESD22 and MIL-STD-750, qualification testing is in-process and data will be provided when completed, approximately end Q3-2021.
●Earliest Effective Date of Change:
■To be determined after completion of qualification testing.
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CEN1374 、 CWDM3011N 、 CWDM3011P 、 CWDM305N 、 CWDM305ND 、 CWDM305P 、 CWDM305PD |
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PCN/EOL |
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Please see the document for details |
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SOIC-8 |
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English Chinese Chinese and English Japanese |
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August 5, 2021 |
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R0 |
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PCN #203 |
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134 KB |
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